Today's Message Index:
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1. 11:29 AM - OVM14 MkIII, rev P2 (Robert L. Nuckolls, III)
2. 07:29 PM - Re: OVM14 MkIII, rev P2 (Eric Page)
Message 1
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| Subject: | OVM14 MkIII, rev P2 |
The upgrade to the AEC9003 CBOV Module has not been
laying dormant. I've been working the ECB layout which
is by necessity, a multi-day task. It might take me
a few hours to do a first pass on the layout but then
I need to put it down for a day or so and come back
for an integrity check. If any 'bugs' identified,
fix'em and set it down again to 'mature'. If the
next check is good, I can do an ECB fabrication paste
up. Day later, check one more time and get a quote
on the first fabrication order. In this case, I can
get 45 boards on a 'proto' order. Double sided, plated
thru, tin-lead plated traces, solder masked both sides
for $90. That comes out to $2 per board. Fair 'nuf.
I've posted the documents to the website at:
http://aeroelectric.com/AEC_Legacy_Products/9003/AEC9003%20MkIII%20Check%20Drawings.pdf
Anyone adept at 500-piece jigsaw puzzles will find
this 20-piece puzzle no big deal. Any assistance
with making sure it wasn't a foggy day at this
end is appreciated.
I'll get an order in for the boards along with one
to Digikey for parts not already on hand. We should
have parts on hand for first production proof
batch by end of next week.
Need to go to Wichita next week. I'll pick
up my loaned out environmental chamber.
We'll want to get a look at temperature
effects on performance of the first articles.
Bob . . .
////
(o o)
===========o00o=(_)=o00o========
< Go ahead, make my day . . . >
< show me where I'm wrong. >
================================
In the interest of creative evolution
of the-best-we-know-how-to-do based
on physics and good practice.
Message 2
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| Subject: | Re: OVM14 MkIII, rev P2 |
nuckolls.bob(at)aeroelect wrote:
> Any assistance with making sure it wasn't a foggy day at this end is appreciated.
It looks to me that the layout matches the schematic perfectly. Just a few comments
to offer:
Suggest not placing vias within the borders of SMD pads unless the they'll be
filled with copper (at most board fabs, that's a high-cost option). As-is, the
vias will tend to wick solder away from the components and may produce poor
soldering results.
Are you planning to remove the middle leg of the SCR and surface-mount the part?
If so, there will be a trace and vias, connected to MT1, sitting directly
under the MT2 tab. Unless the vias are tented, the one at the end of that trace
will put exposed copper under the exposed tab, possibly touching.
It appears that the wires will be soldered to surface pads. I tried that once
and it didn't take much effort for the wires pull pads off the board. Suggest
using through-holes to attach wires -or- put drilled holes near the pads so
that the wires can pass through the board from top to bottom for mechanical support
before soldering.
Read this topic online here:
http://forums.matronics.com/viewtopic.php?p=511660#511660
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